Universal leadless chip carrier mounting pad

Electricity: electrical systems and devices – Miscellaneous

Patent

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Details

174 685, 361406, 361409, H05K 102

Patent

active

044893655

ABSTRACT:
The present disclosure describes a universal leadless chip carrier mounting pad layout for an interconnection medium such as a printed circuit board, which accommodates a wide range of chip carrier sizes. Thus, there is eliminated the traditional method of providing custom pad layouts homologously configured as to numbers of pads and their arrangement, in specific chip carriers. The universality of the present pad layout makes it especially desirable for prototype designs, and integrated circuit chip "burn in" and test procedures.

REFERENCES:
patent: 3716761 (1973-02-01), Rotast
patent: 4195195 (1980-03-01), Miranda et al.
patent: 4326239 (1982-04-01), Ohsawa et al.

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