Special receptacle or package – For a building component – Shingle
Patent
1988-10-31
1992-05-12
Price, William I.
Special receptacle or package
For a building component
Shingle
B65D 7302
Patent
active
051119358
ABSTRACT:
A leadframe carrier and insert compatible with a temperature-affectable, expandable and contractable leadframe strip to be bonded with a selected plurality of semiconductor chips, said carrier being automatically separable and removable with regard to said insert during manufacture despite possible clinging which may be induced by the expansion and contraction of said carrier insert.
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Bond Robert H.
Garrison Linn C.
Morrison Barry
Olla Michael A.
Griggs Dennis T.
Jorgenson Lisa K.
Price William I.
Robinson Richard K.
SGS-Thomson Microelectronics Inc.
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