Universal edged-based wafer alignment apparatus

Details Universal edged-based wafer alignment apparatus Universal edged-based wafer alignment apparatus

1986-03-21

1990-03-06

Rosenberger, Richard A.

Optics: measuring and testing

Angle measuring or angular axial alignment

Sides of angle or axes being aligned transverse to optical...

356400, G01B 1100

Patent

active

049070355

ABSTRACT:
An apparatus for aligning a wafer. The edge of a wafer is mapped by means of a photodetector array and a light source to provide a signal representative of the X-Y position and angular orientation of the wafer as the wafer is rotated one revolution on a shaft. The signal is digitized and processed to provide stored information of the X-Y position and angular orientation of the wafer. The shaft is then rotated to move the wafer from its calculated angular orientation to a desired angular orientation. The X-Y positional information may be used to center the wafer.

REFERENCES:
patent: 3604940 (1971-09-01), Matthews
patent: 3826576 (1974-07-01), Stewart
patent: 4021119 (1977-05-01), Stauffer
patent: 4328553 (1982-04-01), Fredriksen et al.
patent: 4402613 (1983-09-01), Daly et al.
patent: 4425075 (1984-01-01), Quinn
patent: 4457664 (1984-07-01), Judell et al.
patent: 4676648 (1987-06-01), Schulz et al.

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