Universal copper-plating solution

Details Universal copper-plating solution Universal copper-plating solution

1979-07-23

1981-02-03

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, 427437, C23C 302

Patent

active

042486335

ABSTRACT:
A copper-plating bath suitable for reprographic uses and for making electrically conducting metal patterns with one of the redox pairs V.sup.2+ /V.sup.3+, Ti.sup.2+ /Ti.sup.3+, or Cr.sup.2+ /Cr.sup.3+ as a reducing agent, ascorbic acid with an acid acceptor, or the redox pair Fe.sup.2+ /Fe.sup.3+ together with an organic carboxylic acid and a complexing agent for cuprous ions.

REFERENCES:
patent: 3663242 (1972-05-01), Gulla et al.
patent: 3718465 (1973-02-01), Ekman

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