Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-09-18
1999-09-28
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361772, 361783, 174261, 257686, 257692, 257723, 257786, H05K 702
Patent
active
059598450
ABSTRACT:
A circuit board for receiving different chip modules at each chip module site has a site for receiving a chip module having electrical connectors thereon and a first set of contacts at the chip module site having a first arrangement for receiving a chip module having an electrical connector footprint conforming to the first module contact arrangement. There is also provided a second set of contacts at the chip module site having a second arrangement for receiving a chip module having an electrical connector footprint conforming to the second module contact arrangement, the second set of contacts having a different arrangement than, and being electrically connected to, the first set of contacts.
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Dual-In-Line Package Socket "Piggyback" Structure, D.J. McAtee, IBM Technical Disclosure Bulletin. p. 1315, vol. 16 No. 4, Sep. 1973.
Module Interconnection Using Hybrid Attachment, R.A. Foster, E. Tayar, G. Schrottke, IBM Technical Disclosure Bulletin, pp. 330-331, vol. 35 No. 7, Dec. 1992.
International Business Machines - Corporation
Leas James M.
Peterson Peter W.
Picard Leo P.
Vigushin John B.
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