Universal carrier supported thin copper line

Details Universal carrier supported thin copper line Universal carrier supported thin copper line

1992-09-18

1994-06-21

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

156289, 428650, 428674, H05K 100

Patent

active

053229754

ABSTRACT:
An easily peelable or chemically strippable laminate and method of making same comprising an aluminum carrier, an aluminum oxide layer, which is at least 800 Angstroms thick and deposited on the aluminum carrier, copper foil electrodeposited on the aluminum oxide layer and optionally, a brass layer electrodeposited on the copper foil have been discovered. Such laminates find utility in the electronics industry in the fabrication of printed circuit boards and afford an ease of strippability of the protective aluminum carrier-aluminum oxide layer heretofore unknown in the industry. The protective aluminum carrier-aluminum oxide layer of the laminates of the present invention may also be chemically etched away providing a universal carrier for copper foil.

REFERENCES:
patent: 3969199 (1976-07-01), Berdan et al.
patent: 3998601 (1976-12-01), Yates et al.
patent: 4049481 (1977-09-01), Morisaki
patent: 4088544 (1978-05-01), Hutkin
patent: 4431710 (1984-02-01), Lifshin et al.
patent: 4452664 (1984-06-01), Grey, Jr. et al.
patent: 4455181 (1984-06-01), Lifshin et al.

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