Universal apparatus for forming lead wires

Details Universal apparatus for forming lead wires Universal apparatus for forming lead wires

1991-06-20

1992-10-13

Eley, Timothy V.

Metal working

Means to assemble or disassemble

With means to regulate operation by use of templet, tape,...

29741, 29840, B23P 1900, H05K 1304

Patent

active

051539810

ABSTRACT:
Lead wires (4) extending out from an electrical circuit device (2) are shaped for engagement to a substrate (38,40) upon which the device (2) is placed by engaging the lead wires (4) at a location laterally spaced from the device (2), exerting a force on the lead wire (4) at the engagement location to bend it down to the substrate (38,40), and then applying an inward force on the bent lead wire (4) towards the device (2) to further bend the wire to the desired shape. The lead wire (4) is engaged by a forming tool (21,27,33) having a universal head that applies the inward force either by biting into the lead wire (4) with a sharp edge (26), or by moving a bearing wall (36) against the end of the wire (4). When the forming tool (21,27,33) is operated by a programmable wire bonding system, the wire forming operation can be integrated with the bonding operation by using the same forming tool (21,27,33 ) to perform both functions. A single tool can be used to accommodate many different types of circuit packages and lead wire configurations.

REFERENCES:
patent: 4622740 (1986-11-01), Mirley, Jr.
patent: 4726114 (1988-02-01), Staviski
patent: 4908931 (1990-03-01), Itoh et al.

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