Unitary wafer plasma enhanced chemical vapor deposition holding

Details Unitary wafer plasma enhanced chemical vapor deposition holding Unitary wafer plasma enhanced chemical vapor deposition holding

1993-12-03

1995-12-26

Breneman, R. Bruce

Coating apparatus

Gas or vapor deposition

Work support

118723E, 118725, C23C 1600

Patent

active

054783992

ABSTRACT:
There is a unitary wafer plasma enhanced chemical vapor deposition (PECVD) holding device. Particularly, there is a unitary device used for holding and rotating wafers during deposition of materials. Uniquely, single wafer holder arms 31 can be mounted and removed from the unitary device. Additionally, each wafer holding arm can individually calibrate the alignment between the parallel pair of arms and calibrate the wafer positioning to the heater. For example, using a simple screw to bias the positioning of the arms.

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