Patent
1982-02-08
1985-06-18
Sikes, William L.
350 9611, 350 9620, G02B 514
Patent
active
045238022
ABSTRACT:
A mount arrangement of a semiconductor laser and an optical fiber as a unitary structure. A substrate has a submount disposed thereon mounting a semiconductor laser. The laser is fixed on the submount by a fusion-welding material. A fiber submount is disposed on the substrate in the vicinity of the semiconductor laser submount. An optical fiber is fixed to the fiber submount with its optical axis coaxial with the optical axis of the output light of the semiconductor laser. The fiber submount includes a material for fixing the optical fiber and has a melting point such that it will not affect the coaxial optical alignment of the semiconductor laser and the optical fiber and the fixing between the substrate, the laser submount and between the laser submount and semiconductor laser during fabrication. The thickness of the semiconductor laser submount and the fiber submount are selected in terms of the interrelation between the coefficients of linear thermal expansion of the materials forming them and the coefficient of linear thermal expansion of the optical fiber from the substrate, which are caused by temperature variations in a range including temperature variations during fabrication, are substantially equal to each other and displacement between the optical axes of the light output of the laser and optical fiber is avoided. The retention of the axes coaxial alignment minimizes reduction of the efficiency of the coupling of the optical fiber to the semiconductor laser.
REFERENCES:
patent: 4030811 (1977-06-01), Khoe et al.
patent: 4296998 (1981-10-01), Dufft
IBM Technical Disclosure Bulletin, Optical Fiber-Waveguide Coupler, Lynch, vol. 21, No. 10, Mar. 1979.
Electrical Communication Laboratories, NTT, Yokosuka, Japan, Sep. 19, 1980, Kuwahara et al.
Okada Akira
Sakaguchi Haruo
Seki Norio
Yamamoto Shu
Adams Bruce L.
Burns Robert E.
Kokusai Denshin Denwa Kabushiki Kaisha
Lobato Emmanuel J.
Sikes William L.
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