Unit printed circuit board carrier frame for ball grid array sem

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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361707, 361709, 361717, 361718, 361723, 361808, 257675, 257676, 257707, 257713, 174 521, 174 524, 438107, 438111, 438113, 438122, 438458, 438464, 29827, H05K 720

Patent

active

058547410

ABSTRACT:
A unit printed circuit board (PCB) carrier frame used in the fabrication of a heat sink-attached ball grid array (BGA) semiconductor packages and a method for BGA semiconductor packages using the unit PCB carrier frame. The unit PCB carrier frame has a plurality of die pads each defined at its peripheral edges by elongated slots formed at a strip or reel-shaped frame member. For the fabrication of heat sink-attached BGA semiconductor packages, unit PCBs are bonded to the die pads of the unit PCB carrier frame. Accordingly, the bending of the packages is minimized even when they pass through subsequent processes requiring a high temperature. As a result, it is possible to obtain a maximum number of unit PCBs from a PCB panel, thereby achieving an improvement in productivity.

REFERENCES:
patent: 4691225 (1987-09-01), Murakami et al.
patent: 5473514 (1995-12-01), Nagano
patent: 5583378 (1996-12-01), Marrs et al.
patent: 5614443 (1997-03-01), Nakashima et al.
patent: 5671531 (1997-09-01), Mugiya

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