Unique packaging method for use on large semiconductor devices

Details Unique packaging method for use on large semiconductor devices Unique packaging method for use on large semiconductor devices

1976-08-09

1977-12-20

Tupman, W.

Metal working

Method of mechanical manufacture

Assembling or joining

29589, 357 79, B01J 1700

Patent

active

040633489

ABSTRACT:
A silicon controlled rectifier having a triangular base with a planar mounting surface and holes at the apices of the angles to receive screws for mounting the rectifier to a heat sink surface. A cylindrical anode is connected to the base and a semiconductor pellet is positioned on the base within the cylindrical anode. A spring loaded cathode tube is positioned coaxially within the cylindrical anode in engagement with the semiconductor pellet and a spring loaded gate is positioned coaxially within the cathode tube in engagement with the pellet to pressure mount the pellet on the base.

REFERENCES:
patent: 3192454 (1965-06-01), Rosenheinrich
patent: 3480844 (1969-11-01), Lewis
patent: 3512249 (1970-05-01), Lewis

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