Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-06-28
2011-06-28
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S690000, C361S694000, C361S695000, C361S702000, C165S080300, C165S908000, C062S259200
Reexamination Certificate
active
07969734
ABSTRACT:
Disclosed is a system for cooling an electronics package. The system includes a fluid pump and a microcooler assembly. The system utilizes one or more cooling layers interspersed with layers of electronics in the electronics package. Each cooling layer has an array of cooling channels formed in a substrate, an input manifold through which cooling fluid is provided for distribution through the array of cooling channels, and an output manifold which collects fluid from the array of cooling channels. The elements of the cooling system are integrated by conduits including a package conduit for passage of fluid from the fluid pump to the electronics package, a cooler conduit for passage of fluid from the electronics package to the microcooler assembly, and a pump conduit for passage of fluid from the microcooler assembly to the fluid pump. Also disclosed is a method for cooling the electronics package.
REFERENCES:
patent: 4912600 (1990-03-01), Jaeger et al.
patent: 5001548 (1991-03-01), Iversen
patent: 5094594 (1992-03-01), Brennan
patent: 5666817 (1997-09-01), Schulak et al.
patent: 5719444 (1998-02-01), Tilton et al.
patent: 6808371 (2004-10-01), Niwatsukino et al.
patent: 7010930 (2006-03-01), Arik et al.
patent: 7334630 (2008-02-01), Goodson et al.
patent: 7495914 (2009-02-01), Tilton et al.
patent: 2004/0104012 (2004-06-01), Zhou et al.
patent: 2006/0026983 (2006-02-01), Tilton et al.
patent: 2007/0295481 (2007-12-01), Campbell et al.
Arik Mehmet
Balan Chellappa
Byrd Charles Max
Solovitz Stephen Adam
Weaver, Jr. Stanton Earl
Gandhi Jayprakash N
General Electric Company
Patnode Patrick K.
Smith Courtney
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