Uniformity for semiconductor patterning operations

Details Uniformity for semiconductor patterning operations Uniformity for semiconductor patterning operations

2011-04-12

2011-04-12

Whitmore, Stacy A (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Design of semiconductor mask or reticle

C716S055000, C430S005000, C438S706000

Reexamination Certificate

active

07926001

ABSTRACT:
Systems and methods of semiconductor device optimization include a system and method to determine a dataset for a layer of the semiconductor device, where the operation includes receiving a dataset defining a plurality of original patterns of sacrificial material in a layer of a semiconductor device, wherein the original patterns of sacrificial material are used to define placement of spacer material to define patterning of circuit elements for the semiconductor device; determining densities of the plurality of original patterns of sacrificial material in areas across a portion of the layer of the semiconductor device; and augmenting the dataset to include an additional pattern of sacrificial material in an area of the layer having a density lower than a threshold density.

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