Uniform trench fill recess by means of isotropic etching

Details Uniform trench fill recess by means of isotropic etching Uniform trench fill recess by means of isotropic etching

1996-05-16

1997-11-04

Tsai, Jey

Fishing, trapping, and vermin destroying

437 67, 437203, 148DIG50, H01L 21302

Patent

active

056839456

ABSTRACT:
A procedure for forming uniformly recessed fills of trench structures that maintains a planar wafer surface without need of any intermediate or final planarization technique. The procedure relies on isotropical etches with high selectivities and the presence of a sacrificial layer. Its only design requirement is that all trenches must at least have one dimension smaller than twice the recess depth.

REFERENCES:
patent: 5006482 (1991-04-01), Kerbaugh et al.
patent: 5229316 (1993-07-01), Lee et al.
patent: 5270265 (1993-12-01), Hemmenway et al.
patent: 5406515 (1995-04-01), Rajeevakumar
patent: 5422294 (1995-06-01), Noble, Jr.
patent: 5540811 (1996-07-01), Morita

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