Electric heating – Inductive heating – Specific heating application
Reexamination Certificate
2007-08-28
2007-08-28
Robinson, Daniel (Department: 3742)
Electric heating
Inductive heating
Specific heating application
C219S646000
Reexamination Certificate
active
10943659
ABSTRACT:
An elongated substrate may be heated in a roll processing system. At least a portion of the elongated substrate is loaded into the roll processing system. A sufficient electrical current is caused to flow in the portion of the elongated substrate to heat the portion to a desired temperature. The heating may be either resistive or inductive. The roll processing system may be a roll-to-roll type where the substrate moves as a portion of it is heated. Alternatively, the substrate may be wound into a coiled substrate and the turns of the coil insulated against undesired electrical contact. The entire coiled substrate may then be heated either resistively or inductively.
REFERENCES:
patent: 4405386 (1983-09-01), Mravic et al.
patent: 4665303 (1987-05-01), Miyakawa et al.
patent: 5567448 (1996-10-01), Frankland
patent: 5571368 (1996-11-01), Barge
patent: 6239411 (2001-05-01), Ito
patent: 6438349 (2002-08-01), Ando
patent: 6849837 (2005-02-01), Riess et al.
patent: 2002/0012846 (2002-01-01), Skotheim et al.
patent: 2002/0148830 (2002-10-01), Ross
patent: 2004/0219730 (2004-11-01), Basol
U.S. Appl. No. 10/782,545, titled “High Throughput Surface Treatment on Coiled Flexible Substrates”, filed Feb. 19, 2004, (NSL-025).
U.S. Appl. No. 10/782,017, titled “Solution-Based Fabrication of Photovoltaic Cell”, filed Feb. 19, 2004, (NSL-029).
U.S. Appl. No. 10/943,658, titled “Formation of CIGS Absorber Layer Materials Using Atomic Layer Deposition and High Throughput Surface Treatment”, filed Sep. 18, 2004, (NSL-035).
U.S. Appl. No. 10/943,685, titled “Formation of CIGS Absorber Layers on Foil Substrates”, filed Sep. 18, 2004 (NSL-038).
Isenberg Joshua D.
JDI Patent
Nanosolar, Inc.
Robinson Daniel
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