Uniform plating of dendrites

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – With textured surface

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Details

257734, 257779, H01L 2348

Patent

active

059397861

ABSTRACT:
The present invention provides uniform dendrites, on circuit features instead of large, elongated dendrites along the edges of the circuit features. The dendrites are formed by a method comprising the following steps: providing a substrate having circuitry disposed thereon; applying a photoresist to the substrate at a thickness which is preferably about the height of the intended dendrite height; imaging the photoresist to expose all or a portion of the top surface of the circuitry; forming the dendrites; and removing the photoresist. The photoresist which is employed to control the dendrite height is applied so that the photoresist either: abuts the edge of the circuitry leaving the top surface of the circuitry exposed; or abuts the edge of the circuitry and extend over the top edge of the circuitry so that a portion of the top surface of the circuitry is exposed; or does not touch the circuitry nor an area surrounding the base of the circuitry. The method of the present invention provides uniform dendrites, that is, the dendrites along the edge of the circuitry are within about 50%, preferably about 40%, more preferably within about 25% of the average dendrite height; preferably the dendrites along the edge of the circuitry are within 10% of the highest non-edge dendrite. The invention also relates to electronic structures having uniform dendrites disposed thereon.

REFERENCES:
patent: 5019944 (1991-05-01), Ishii et al.
patent: 5118299 (1992-06-01), Burns et al.
patent: 5172473 (1992-12-01), Burns et al.
patent: 5185073 (1993-02-01), Bindra et al.
patent: 5190463 (1993-03-01), Datta et al.
patent: 5298685 (1994-03-01), Bindra et al.
patent: 5435057 (1995-07-01), Bindra et al.

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