Uniform leadframe carrier

Special receptacle or package – For a building component – Shingle

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Details

357 75, 206330, 29740, B65D 7302

Patent

active

048155950

ABSTRACT:
A leadframe carrier and insert compatible with a temperature-affectable, expandable and contractable leadframe strip to be bonded with a selected plurality of semiconductor chips, said carrier being automatically separable and removable with regard to said insert during manufacture despite possible clinging which may be induced by the expansion and contraction of said carrier insert.

REFERENCES:
patent: 3385426 (1968-05-01), May et al.
patent: 3407925 (1968-10-01), Ruehlemann
patent: 3469684 (1969-09-01), Keady et al.
patent: 3550766 (1970-12-01), Nixen et al.
patent: 3571920 (1971-03-01), Berg
patent: 4386463 (1983-06-01), McLaughlin
patent: 4627533 (1986-12-01), Pollard
patent: 4661886 (1987-04-01), Nelson et al.
patent: 4692790 (1987-09-01), Oyamada

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