Uniform gas flow arrangements

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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1566431, 1566461, 216 67, H01L 213065

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056393342

ABSTRACT:
A uniform gas flow is provided at the surface of a planar device or wafer in a processing system having a substantially cylindrical chamber through which processing gases flow toward an asymmetrically located outlet port by using an appropriately disposed collar or baffle along the gas stream in the chamber in the plane of the surface of the planar device or wafer.

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