Uniform gas flow arrangements

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

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438716, 438935, 427 9, 20429815, 20429807, 20429833, H01L 21302

Patent

active

057893241

ABSTRACT:
A uniform gas flow is provided at the surface of a planar device or wafer in a processing system having a substantially cylindrical chamber through which processing gases flow toward an asymmetrically located outlet port by using an appropriately disposed collar or baffle along the gas stream in the chamber in the plane of the surface of the planar device or wafer.

REFERENCES:
patent: 3745969 (1973-07-01), Huffman et al.
patent: 4512841 (1985-04-01), Cunningham, Jr. et al.
patent: 5271788 (1993-12-01), Hasegawa et al.
patent: 5552017 (1996-09-01), Jang et al.
patent: 5620576 (1997-04-01), Wordenweber

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