Uniform electroplating of printed circuit boards

Details Uniform electroplating of printed circuit boards Uniform electroplating of printed circuit boards

1992-07-02

1994-01-25

Tufariello, T. M.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

204194, C25D 502, C25D 1700

Patent

active

052813258

ABSTRACT:
A method and apparatus for the uniform electroplating of printed circuit boards is described. At least one non conductive apertured mask covers selected areas of the electroactive surface of the anode or cathode electrode, whereby to establish substantially uniform electroplating ion transfer over the target areas of the target cathode.

REFERENCES:
patent: 3809642 (1974-05-01), Bond

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