Unified semiconductor wafer packaging system to unify irregular

Special receptacle or package – Holder for a removable electrical component – For a semiconductor wafer

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206504, 206593, B65D 8530

Patent

active

058758968

ABSTRACT:
A semiconductor wafer packaging system to cushion semiconductor wafers from damage from shock and vibration during transportation is described. The semiconductor wafer packaging system has at least one a wafer case to enclose the semiconductor wafers. Each wafer case is placed within a wafer case padding unit. Each padding unit includes a rectangular cushioning block and a plurality of trapezoidal spacer blocks affixed to the four sides of the rectangular cushioning block. The rectangular cushioning block has an opening to accept the wafer case and a plurality of trapezoidal notches on two adjoining sides of the rectangular cushioning block. The wafer case padding unit is placed within a packaging canister for transportation.

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