Unibody pressure transducer package

Details Unibody pressure transducer package Unibody pressure transducer package

1985-10-07

1987-04-07

Woodiel, Donald O.

Measuring and testing

Fluid pressure gauge

Mounting and connection

73431, 73717, 73723, 73DIG4, G01L 1914, G01L 900

Patent

active

046550887

ABSTRACT:
A one piece housing suitable for housing semiconductor chips is molded from a polymer material. Electrical leads pass through a molded one piece housing to provide electrical contact between the semiconductor die and external circuitry. A hole can be provided in the bottom of the package if the package is to be used as a unibody pressure transducer package.

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