Underlay surface modification to control resin glass polymerizat

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427 40, 427 431, B05D 306

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active

046019138

ABSTRACT:
Three-dimensional polymerization of resin glass on an underlay surface may cause uneven distribution of the layer and therefore uneven etching of the glass layer in subsequent processing. The glass remaining after an etching step can cause difficulties in further processing of the structure, such as causing metal opens in a metallization step. In order to control the three-dimensional polymerization; the underlay surface is treated with a short plasma treatment. The plasma oxidizing step renders the surface acidic, forcing the glass polymerization to occur in a two-dimensional mode thereby eliminating the threat of uneven distribution and its repercussions.

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