Underlay substrate for printing a printed circuit on a...

Details Underlay substrate for printing a printed circuit on a... Underlay substrate for printing a printed circuit on a...

2011-03-22

2011-03-22

Kornakov, Michael (Department: 1712)

Printing

Stenciling

Stencil and work support

C101S114000, C101S127000, C101S127100, C101S129000, C101S163000, C427S098400, C427S058000, C427S096100, C427S282000, C427S294000

Reexamination Certificate

active

07908965

ABSTRACT:
A plurality of through holes having an equal size are formed in an underlay substrate. Positions of the plurality of through holes are suitably set according to the shape of a substrate sheet. Specifically, an equal number of through holes are formed in each of end blank corresponding regions that, when the substrate sheet and the underlay substrate are overlapped with each other, overlap with end blank regions of the substrate sheet, of the underlay substrate. In addition, the through holes are formed at equal spacing in portions excluding the end blank corresponding regions in a blank corresponding region, which overlaps with a blank region of the substrate sheet, of the underlay substrate.

REFERENCES:
patent: 1-115272 (1989-08-01), None
patent: 2001-101637 (2001-04-01), None

Affiliated with

Also associated with

Rating

Underlay substrate for printing a printed circuit on a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Underlay substrate for printing a printed circuit on a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Underlay substrate for printing a printed circuit on a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2745037