Underfilling material for semiconductor package

Details Underfilling material for semiconductor package Underfilling material for semiconductor package

2005-04-19

2005-04-19

Graybill, David E. (Department: 2822)

Semiconductor device manufacturing: process

Repair or restoration

C438S108000, C438S118000

Reexamination Certificate

active

06881591

ABSTRACT:
An underfilling material for a semiconductor package holding semiconductor elements on a carrier substrate mounted on a circuit board, containing a one-pack type thermosetting urethane composition which preferably comprises a urethane prepolymer having a terminal isocyanate group, which is obtained by reacting a polyol with an excessive amount of a polyisocyanate, and a fine powder-coated curing agent comprising a curing agent which is in a solid state at room temperature and surface active sites of which are covered with a fine powder. This composition can achieve both the low temperature curing properties and the storage stability.

REFERENCES:
patent: 4499149 (1985-02-01), Berger
patent: 5061776 (1991-10-01), Weaver et al.
patent: 5249101 (1993-09-01), Frey et al.
patent: 5262465 (1993-11-01), Ott et al.
patent: 5288944 (1994-02-01), Bronson et al.
patent: 5386624 (1995-02-01), George et al.
patent: 5390082 (1995-02-01), Chase et al.
patent: 5450283 (1995-09-01), Lin et al.
patent: 5533256 (1996-07-01), Call et al.
patent: 5641996 (1997-06-01), Omoya et al.
patent: 5804882 (1998-09-01), Tsukagoshi et al.
patent: 5929512 (1999-07-01), Jacobs
patent: 6037043 (2000-03-01), Lehner et al.
patent: 6069024 (2000-05-01), Murakami
patent: 6121070 (2000-09-01), Akram
patent: 6252308 (2001-06-01), Akram et al.
patent: 6255138 (2001-07-01), Haishima
patent: 6297076 (2001-10-01), Amagai et al.
patent: 6309915 (2001-10-01), Distefano
patent: 6406990 (2002-06-01), Kawai
patent: 6492204 (2002-12-01), Jacobs
patent: 6507101 (2003-01-01), Morris
patent: 6534858 (2003-03-01), Akram et al.
patent: 0757067 (1995-03-01), None
patent: 2713760 (1990-09-01), None
patent: 2738487 (1994-06-01), None
patent: 10204259 (1998-08-01), None
patent: 2000-220481 (2000-01-01), None
patent: WO 9831738 (1998-11-01), None
“Solder Joint Life Improvement Using Adhesive Under Component”, Research Disclosure—2244—(Jan., 1990) No. 309, New York, US—XP 000099320 .

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