Underfill process

Details Underfill process Underfill process

2000-04-06

2009-06-16

Graybill, David E (Department: 2894)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S119000, C438S406000, C438S455000, C438S456000, C438S457000, C438S458000, C438S459000, C438S615000, C438S616000, C438S617000

Reexamination Certificate

active

07547579

ABSTRACT:
A method and apparatus for underfilling a gap between a semiconductor die or device and a substrate, where the semiconductor die or device is electrically connected to the substrate so that an active surface of the semiconductor die is facing a top surface of the substrate with the gap therebetween. A silane layer is applied to the active surface of the semiconductor die, the upper surface of the substrate, and/or both to increase the surface tension thereon. The increased surface tension thereby allows the underfill material to fill the gap via capillary action in a lesser flow time more effectively, and therefore, is more efficient than conventional underfilling methods.

REFERENCES:
patent: 3079361 (1963-02-01), Plueddemann
patent: 3619246 (1971-11-01), Bragole
patent: 3854793 (1974-12-01), Kahn
patent: 3869787 (1975-03-01), Umbaugh
patent: 4231910 (1980-11-01), Plueddemann
patent: 4238528 (1980-12-01), Angelo et al.
patent: 4388132 (1983-06-01), Hoge et al.
patent: 4689085 (1987-08-01), Plueddemann
patent: 4690959 (1987-09-01), Plueddemann
patent: 4718944 (1988-01-01), Plueddemann
patent: 4719262 (1988-01-01), Plueddemann
patent: 4786528 (1988-11-01), Amelio et al.
patent: 4800125 (1989-01-01), Plueddemann
patent: 4849294 (1989-07-01), Plueddemann
patent: 4863978 (1989-09-01), Plueddemann
patent: 4871788 (1989-10-01), Plueddemann
patent: 4961967 (1990-10-01), Pluddemann
patent: 5001011 (1991-03-01), Plueddemann
patent: 5002831 (1991-03-01), Plueddemann
patent: 5006573 (1991-04-01), Plueddemann
patent: 5041593 (1991-08-01), Plueddemann
patent: 5053048 (1991-10-01), Pinchuk
patent: 5078475 (1992-01-01), Sekimura et al.
patent: 5089300 (1992-02-01), Plueddemann
patent: 5203076 (1993-04-01), Banerji et al.
patent: 5212402 (1993-05-01), Higgins, III
patent: 5218234 (1993-06-01), Thompson et al.
patent: 5239447 (1993-08-01), Cotues et al.
patent: 5258648 (1993-11-01), Lin
patent: 5311059 (1994-05-01), Banerji et al.
patent: RE34675 (1994-07-01), Plueddemann
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5385869 (1995-01-01), Lin et al.
patent: 5410181 (1995-04-01), Zollo et al.
patent: 5438219 (1995-08-01), Kotzan et al.
patent: 5439162 (1995-08-01), George et al.
patent: 5442240 (1995-08-01), Mukerji
patent: 5450283 (1995-09-01), Lin et al.
patent: 5468995 (1995-11-01), Higgins, III
patent: 5492863 (1996-02-01), Higgins, III
patent: 5498576 (1996-03-01), Hotchkiss et al.
patent: 5532187 (1996-07-01), Schreiber-Prillwitz et al.
patent: 5552638 (1996-09-01), O'Connor et al.
patent: 5639555 (1997-06-01), Bishop
patent: 5651179 (1997-07-01), Bessho et al.
patent: 5710071 (1998-01-01), Beddingfield et al.
patent: 5736251 (1998-04-01), Pinchuk
patent: 5766982 (1998-06-01), Akram et al.
patent: 5783867 (1998-07-01), Belke et al.
patent: 5855821 (1999-01-01), Chau et al.
patent: 5863970 (1999-01-01), Ghoshal et al.
patent: 5864178 (1999-01-01), Yamada et al.
patent: 5897914 (1999-04-01), DePriest
patent: 5928791 (1999-07-01), Rosenmayer
patent: 5959363 (1999-09-01), Yamada et al.
patent: 5960258 (1999-09-01), Moden
patent: 5972739 (1999-10-01), Funada et al.
patent: 5973404 (1999-10-01), Akram et al.
patent: 5975408 (1999-11-01), Goossen
patent: 5981312 (1999-11-01), Farquhar et al.
patent: 5998242 (1999-12-01), Kirkpatrick et al.
patent: 6000924 (1999-12-01), Wang et al.
patent: 6002171 (1999-12-01), Desai et al.
patent: 6054769 (2000-04-01), Jeng
patent: 6057381 (2000-05-01), Ma et al.
patent: 6063828 (2000-05-01), Ma et al.
patent: 6074895 (2000-06-01), Dery et al.
patent: 6103549 (2000-08-01), Master et al.
patent: 6108210 (2000-08-01), Chung
patent: 6121689 (2000-09-01), Capote et al.
patent: 6165386 (2000-12-01), Endo et al.
patent: 6180187 (2001-01-01), Ma et al.
patent: 6180696 (2001-01-01), Wong et al.
patent: 6187374 (2001-02-01), Hardy et al.
patent: 6190940 (2001-02-01), DeFelice et al.
patent: 6194788 (2001-02-01), Gilleo et al.
patent: 6201192 (2001-03-01), Wille et al.
patent: 6221998 (2001-04-01), Okuhira et al.
patent: 6228678 (2001-05-01), Gilleo et al.
patent: 6228681 (2001-05-01), Gilleo et al.
patent: 6238223 (2001-05-01), Cobbley et al.
patent: 6248614 (2001-06-01), Kodnani et al.
patent: 6251766 (2001-06-01), Desai et al.
patent: 6261638 (2001-07-01), van Ooij et al.
patent: 6265776 (2001-07-01), Gilleo
patent: 6281567 (2001-08-01), Murayama et al.
patent: 6303277 (2001-10-01), Hieda et al.
patent: 6333206 (2001-12-01), Ito et al.
patent: 6350840 (2002-02-01), Schultz et al.
patent: 6367150 (2002-04-01), Kirsten
patent: 6404643 (2002-06-01), Chung
patent: 6410415 (2002-06-01), Estes et al.
patent: 6416869 (2002-07-01), van Ooij et al.
patent: 6620719 (2003-09-01), Andry et al.
patent: 6827981 (2004-12-01), van Ooij et al.
patent: 2002/0084277 (2002-07-01), Mullens et al.
Surface Tension. http://hyperphysics.phy-astr.gsu.edu/hbase/surten2.html [Jul. 30, 2002].

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