Underfill fluxing curative

Details Underfill fluxing curative Underfill fluxing curative

2007-05-08

2007-05-08

Feely, Michael J. (Department: 1712)

Metal fusion bonding

Process

Plural joints

C428S413000, C428S414000, C523S429000, C523S428000

Reexamination Certificate

active

10817138

ABSTRACT:
The invention is directed to a fluxing curative for curing an underfill that comprises an epoxy resin and for fluxing a solder during a solder assembly of an electronic component to an electronic device substrate and a method for producing the fluxing curative. Specifically, the fluxing curative comprises a salt that is a reaction product of an imidazole component and a carboxylic acid component having at least 10 carbon atoms per molecule. Additionally, the invention is directed to an underfill solution comprising the fluxing curative and a method of attaching an integrated circuit device using the underfill solution.

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