Underfill encapsulant compositions for use in electronic devices

Details Underfill encapsulant compositions for use in electronic devices Underfill encapsulant compositions for use in electronic devices

1998-07-02

2000-05-16

Seidleck, James J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

522 99, 522 90, 522104, 522107, 522148, 522156, 525282, 523400, 523435, 548521, C08F 246, C08F26710, C08G 246, C08K 300

Patent

active

060638281

ABSTRACT:
A curable underfill encapsulant composition, suitable for use in semiconductor packaging, comprises one or more mono- or polyfunctional maleimide compounds, or one or more mono- or polyfunctional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, with a free radical curing agent, and optionally, one or more fillers.

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