Underfill compounds including electrically charged filler...

Details Underfill compounds including electrically charged filler... Underfill compounds including electrically charged filler...

2006-08-22

2006-08-22

Picardat, Kevin M. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S108000, C438S119000

Reexamination Certificate

active

07094628

ABSTRACT:
Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of disposing underfill including electrically charged filler elements on microelectronic devices are disclosed herein. In one embodiment, a microelectronic device includes a microelectronic component, a plurality of electrical couplers carried by the microelectronic component, and an underfill layer covering at least a portion of the electrical couplers. The underfill layer comprises a binder and a plurality of electrically charged filler elements in the binder. The underfill layer can include a first zone having a first concentration of electrically charged filler elements and a second zone having a second concentration of electrically charged filler elements different than the first concentration.

REFERENCES:
patent: 5194930 (1993-03-01), Papathomas et al.
patent: 5352318 (1994-10-01), Takabayashi et al.
patent: 5760337 (1998-06-01), Iyer et al.
patent: 5866953 (1999-02-01), Akram et al.
patent: 5891753 (1999-04-01), Akram
patent: 5898224 (1999-04-01), Akram
patent: 6310288 (2001-10-01), Moden
patent: 6448665 (2002-09-01), Nakazawa et al.
patent: 2003/0022534 (2003-01-01), Terada et al.

Affiliated with

Also associated with

Rating

Underfill compounds including electrically charged filler... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Underfill compounds including electrically charged filler..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Underfill compounds including electrically charged filler... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3705789