Undercutting technique for creating coating in spaced-apart segm

Details Undercutting technique for creating coating in spaced-apart segm Undercutting technique for creating coating in spaced-apart segm

1997-10-31

1999-12-28

Niebling, John F.

Semiconductor device manufacturing: process

Electron emitter manufacture

445 50, 445 51, 313310, 313312, 313336, 313351, 427 10, 427 77, H01L 2100

Patent

active

060080620

ABSTRACT:
A technique for creating a patterned coating entails forming a first region (26) over a primary component (22). A second region (28) is formed over part of the first region. The first region is etched so as to undercut the second region, thereby forming a gap (30) below part of the second region. Coating material is then provided over the structure. Due to the presence of the gap, the coating material accumulates over the structure in a pair of segments spaced apart along the gap. One coating segment (32A) overlies the primary component. The other coating segment (32B) overlies the second region.

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