Under-pad for chemical-mechanical planarization of semiconductor

Details Under-pad for chemical-mechanical planarization of semiconductor Under-pad for chemical-mechanical planarization of semiconductor

1999-01-22

1999-11-09

Rose, Robert A.

Abrading

Abrading process

Glass or stone abrading

451 53, 451287, 451288, 451921, B24B 100

Patent

active

059803630

ABSTRACT:
The present invention is an under-pad placed between a polishing pad and a platen of a planarizing machine used in chemical-mechanical planarization of semiconductor wafers. The under-pad has a body and a plurality of thermal conductors positioned in the body to conduct heat through the body. The body has a top face upon which the polishing pad is positionable and a bottom face engageable with the platen. In operation, heat from the platen and polishing pad flows through the thermal conductors to reduce temperature gradients across the planarizing surface of the polishing pad.

REFERENCES:
patent: 5403228 (1995-04-01), Pasch
patent: 5562529 (1996-10-01), Kishii et al.
patent: 5893754 (1999-04-01), Robinson et al.

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