Ultraviolet detecting device and manufacturing method...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Reexamination Certificate

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C257S351000, C257S431000, C257S432000, C257S443000, C257S461000

Reexamination Certificate

active

08044484

ABSTRACT:
The present invention provides an ultraviolet detecting device which comprises a silicon semiconductor layer having a thickness ranging from greater than or equal to 3 nm to less than or equal to 36 nm, which is formed over an insulating layer, lateral PN-junction type first and second photodiodes formed in the silicon semiconductor layer, an interlayer insulating film formed over the silicon semiconductor layer, a first filter layer made of silicon nitride, which is formed over the interlayer insulating film provided over the first photodiode and causes light lying in a wavelength range of an UV-B wave or higher to pass therethrough, and a second filter layer made of silicon nitride, which is formed over the interlayer insulating film provided over the second photodiode and allows light lying in a wavelength range of an UV-A wave or higher to pass therethrough.

REFERENCES:
patent: 6852565 (2005-02-01), Zhao
patent: 2002/0153569 (2002-10-01), Katayama
patent: 07-162024 (1995-06-01), None
patent: 2002-314117 (2002-10-01), None
Aryan Afzalian et al., “Physical Modeling and Design of Thin-film SOI Lateral PIN Photodiodes,” IEEE Transactions on Electron Devices, vol. 52, No. 5, Jun. 2005 pp. 1116-1122.
Japanese Office Action dated Nov. 18, 2008 with English Translation.

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