Ultraviolet curable solvent-free wire enamel blends

Stock material or miscellaneous articles – Coated or structually defined flake – particle – cell – strand,... – Rod – strand – filament or fiber

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20415915, 20415916, 20415917, 20415919, 525423, 525424, 525440, 525488, 525530, 525920, 525921, 525922, B32B 1508, C08F28304, C08L 6134, C08L 7908

Patent

active

043178588

ABSTRACT:
Disclosed is a wire enamel blend which is curable to the B-stage with UV light then to the C stage with heat. The blend comprises up to about 40% of an acrylated epoxy dissolved in a monoacrylate, about 2 to about 26% of an acrylated polybutadiene, about 3 to about 26% of an acrylated polyester-amide-imide dissolved in a monoacrylate and in an unsatured diester, about 30 to about 65% of an end-blocked urethane dissolved in a monoacrylate and hydroxy terminated unsaturated diesters, up to about 15% of a cresol formaldehyde dissolved in monoacrylates, about 1.5 to about 5% of a UV photoinitiator, up to about 5% of an acrylated methoxymethyl melamine, and up to about 0.1% of a flow control agent.

REFERENCES:
patent: 3673140 (1972-06-01), Ackerman et al.
patent: 4140605 (1979-02-01), Sano et al.
patent: 4260703 (1981-04-01), Hodakowski et al.
patent: 4268659 (1981-05-01), Bederke et al.

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