Etching a substrate: processes – Forming or treating article containing magnetically...
Reexamination Certificate
2010-03-11
2011-12-06
Tran, Binh X (Department: 1713)
Etching a substrate: processes
Forming or treating article containing magnetically...
C216S040000, C216S054000, C216S058000, C428S800000, C522S006000
Reexamination Certificate
active
08070968
ABSTRACT:
According to one embodiment, this invention uses an ultraviolet-curable resin material for pattern transfer containing 80 to 95 wt % of isobornyl acrylate, 1 to 20 wt % of trifunctional acrylate, and 0.5 to 6 wt % of a polymerization initiator.
REFERENCES:
patent: 4832992 (1989-05-01), Yabe et al.
patent: 5519083 (1996-05-01), Ashton et al.
patent: 6531261 (2003-03-01), Usami et al.
patent: 6874262 (2005-04-01), Nishiyama et al.
patent: 6894114 (2005-05-01), Kato et al.
patent: 7122288 (2006-10-01), Kozawa et al.
patent: 7488569 (2009-02-01), Kozawa et al.
patent: 7704425 (2010-04-01), Heidari et al.
patent: 7854873 (2010-12-01), Heidari et al.
patent: 2001/0036594 (2001-11-01), Kozawa et al.
patent: 2002/0177070 (2002-11-01), Kozawa et al.
patent: 2004/0264019 (2004-12-01), Curtiss et al.
patent: 2005/0083597 (2005-04-01), Gauzner et al.
patent: 2005/0256218 (2005-11-01), Lachowicz et al.
patent: 2006/0002021 (2006-01-01), Li et al.
patent: 2006/0051698 (2006-03-01), Miyoshi et al.
patent: 2006/0145373 (2006-07-01), Kiyono et al.
patent: 2006/0263723 (2006-11-01), Kozawa et al.
patent: 2006/0279025 (2006-12-01), Heidari et al.
patent: 2007/0160937 (2007-07-01), Ogino et al.
patent: 2007/0212522 (2007-09-01), Heidari et al.
patent: 2008/0029931 (2008-02-01), Tada et al.
patent: 2008/0152933 (2008-06-01), Mizuno et al.
patent: 2008/0213420 (2008-09-01), Sugimura et al.
patent: 2008/0237938 (2008-10-01), Fukuzawa et al.
patent: 2009/0030107 (2009-01-01), Watanabe et al.
patent: 2009/0104395 (2009-04-01), Bruder et al.
patent: 2010/0159281 (2010-06-01), Morita
patent: 2010/0230384 (2010-09-01), Morita
patent: 2010/0233514 (2010-09-01), Umezawa
patent: 2010/0237041 (2010-09-01), Morita
patent: 60-074133 (1985-04-01), None
patent: 61-137240 (1986-06-01), None
patent: 1986-307374 (1986-12-01), None
patent: 63-159090 (1988-07-01), None
patent: H01-248335 (1989-10-01), None
patent: H03-059831 (1991-03-01), None
patent: H03-069321 (1991-03-01), None
patent: H04-059385 (1992-02-01), None
patent: H04-47903 (1992-08-01), None
patent: H04-337307 (1992-11-01), None
patent: H04-372741 (1992-12-01), None
patent: H05-266472 (1993-10-01), None
patent: 06-158019 (1994-06-01), None
patent: H06-158019 (1994-06-01), None
patent: 06-248251 (1994-09-01), None
patent: H06-248251 (1994-09-01), None
patent: H09-204697 (1997-08-01), None
patent: 11-160848 (1999-06-01), None
patent: 2000-149329 (2000-05-01), None
patent: 2000-348390 (2000-12-01), None
patent: 2001-343748 (2001-12-01), None
patent: 2001-344734 (2001-12-01), None
patent: 2004-103070 (2004-04-01), None
patent: 2004-110896 (2004-04-01), None
patent: 2005-122829 (2005-05-01), None
patent: 2005-166241 (2005-06-01), None
patent: 2006-188383 (2006-07-01), None
patent: 2007-055235 (2007-03-01), None
patent: 2007-131754 (2007-05-01), None
patent: 2007-141370 (2007-06-01), None
patent: 2007-178724 (2007-07-01), None
patent: 2007-186570 (2007-07-01), None
patent: 2007-194304 (2007-08-01), None
patent: 2008-012859 (2008-01-01), None
patent: 2008-19292 (2008-01-01), None
patent: 2008-019292 (2008-01-01), None
patent: 2008-192250 (2008-08-01), None
patent: 4140823 (2008-08-01), None
patent: 2008-251130 (2008-10-01), None
patent: 2008-274244 (2008-11-01), None
patent: 2008-274244 (2008-11-01), None
patent: 4514582 (2010-05-01), None
Information Sheet in 2 pages.
Notification of Reasons of Rejection mailed by Japan Patent Office on Mar. 19, 2011 in the corresponding Japanese patent application No. 2010-265030 in 7 pages.
Notification of Reasons of Rejection mailed by Japan Patent Office on Jan. 11, 2011 in the corresponding Japanese patent application No. 2009-066643 in 4 pages.
Notification of Decision of Rejection mailed by Japan Patent Office on Aug. 31, 2010 in the corresponding Japanese patent application No. 2009-066643 in 4 pages.
Notification of Reasons of Rejection mailed by Japan Patent Office on May 25, 2010 in the corresponding Japanese patent application No. 2009-066643 in 6 pages.
Morita Seiji
Sakurai Masatoshi
Umezawa Kazuyo
Kabushiki Kaisha Toshiba
Knobbe Martens Olson & Bear LLP
Tran Binh X
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