Ultrathin semiconductor circuit having contact bumps

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S781000, C257SE23021, C438S614000

Reexamination Certificate

active

07868452

ABSTRACT:
The invention relates to an ultrathin semiconductor circuit having contact bumps and to a corresponding production method. The semiconductor circuit includes a bump supporting layer having a supporting layer thickness and having a supporting layer opening for uncovering a contact layer element being formed on the surface of a semiconductor circuit. An electrode layer is situated on the surface of the contact layer element within the opening of the bump supporting layer, on which electrode layer is formed a bump metallization for realizing the contact bump. On account of the bump supporting layer, a thickness of the semiconductor circuit can be thinned to well below 300 micrometers, with the wafer reliably being prevented from breaking. Furthermore, the moisture barrier properties of the semiconductor circuit are thereby improved.

REFERENCES:
patent: 3623961 (1971-11-01), van Laer
patent: 6118179 (2000-09-01), Farnworth et al.
patent: 6338980 (2002-01-01), Satoh
patent: 6462415 (2002-10-01), Ishiguri et al.
patent: 6566762 (2003-05-01), Baker et al.
patent: 2002/0025585 (2002-02-01), Lam et al.
patent: 2002/0031868 (2002-03-01), Capote et al.
patent: 2002/0070423 (2002-06-01), Takafuji
patent: 2003/0134496 (2003-07-01), Lee et al.
patent: 2003/0160036 (2003-08-01), Liu
patent: 2003/0214036 (2003-11-01), Sarihan et al.
patent: 08148527 (1996-07-01), None
patent: 11349104 (1999-08-01), None
patent: 2001103041 (2001-02-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Ultrathin semiconductor circuit having contact bumps does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ultrathin semiconductor circuit having contact bumps, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ultrathin semiconductor circuit having contact bumps will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2635400

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.