Ultrasonic wire bonding quality monitor and method

Details Ultrasonic wire bonding quality monitor and method Ultrasonic wire bonding quality monitor and method

1986-05-30

1989-03-21

Lall, Parshotam S.

Boots, shoes, and leggings

228103, 364552, G06F 1546, B23K 2010

Patent

active

048150010

ABSTRACT:
A bond quality monitor and method for monitoring and analyzing the relative quality of bonding operations performed by ultrasonic bonding machines is disclosed. The bond quality monitor (40) includes an analog bond monitoring circuit (42) and a digital microcomputer (44). The bond monitoring circuit, which is placed in series between an ultrasonic signal generator (26) and its corresponding ultrasonic transducer (18), monitors the transducer power signal generated by the ultrasonic signal generator and performs a series of analog computations based on the logarithm of the impedance of the transducer in order to create a measure of bond quality. The microcomputer controls the operation of the bond monitoring circuit and performs comparisons to determine bond quality relative to previously monitored good quality bonds.

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