Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1994-05-23
1995-03-14
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156221, 1565801, B32B 3116
Patent
active
053974085
ABSTRACT:
A method for ultrasonically welding two plastic parts together. One part (30) has a weld joint feature (23) that is covered with a metal layer (27), and the other plastic part (25) has a complimentary weld joint feature. The two parts are joined together by ultrasonically welding the two weld joint features to each other. A force (40) is applied to the first and second plastic parts prior to the step of welding. The force is substantially in excess of that required to cause the two weld joint features to contact each other. This method creates an ultrasonic welded metallized plastic assembly. Each part of the assembly has a weld joint feature, at least one of which was covered with a metal layer prior to welding. Portions of the each of the two weld joint features are deformed to form a plastic weld joint through the metal coating.
REFERENCES:
patent: 4558957 (1985-12-01), Mock et al.
patent: 4954191 (1990-09-01), Delespaul et al.
patent: 4993007 (1991-02-01), Meister
patent: 5176314 (1993-01-01), Akazawa et al.
patent: 5288350 (1994-02-01), Kita
patent: 5316603 (1994-05-01), Akazawa et al.
"Ultrasonic Plastic Assembly--an Introduction" Ian Robinson, Automotive Project Engineer at Lucas Dawe Ultrasonics, Ltd., Welding Review, Nov., 1988.
Guzik Andrzej T.
Hunt Stephen D.
Dorinski Dale W.
Motorola Inc.
Sells J.
Simmons David A.
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