Cutting – Processes – With reorientation of work between cuts
Reexamination Certificate
2000-01-21
2001-06-26
Bray, W. Donald (Department: 3725)
Cutting
Processes
With reorientation of work between cuts
C083S013000, C083S177000, C083S367000, C083S368000, C083S491000, C083S666000, C083S956000, C451S165000
Reexamination Certificate
active
06250188
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an ultrasonic vibration cutting method and apparatus.
2. Description of the Prior Art
In the production of semiconductor devices, attempts are being made to cut a semiconductor wafer incorporating IC's and the like into a plurality of dice-like semiconductor chips called “bare chip” with ultrasonic vibration.
However, cutting of a semiconductor wafer into dice-like semiconductor chips with ultrasonic vibration does not succeed yet. There is no example of success in cutting viscous and soft materials such as gold, silver, aluminum, solder and copper, hard and fragile materials such as ceramics, silicon and ferrite, laminate structures consisting of a synthetic resin and a metal, laminate structures consisting of an inorganic material, a metal and a synthetic resin, and the like with ultrasonic vibration.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide an ultrasonic vibration cutting method and apparatus capable of properly cutting parts having the above physical properties.
According to a first aspect of the present invention, there is provided an ultrasonic vibration cutting method comprising the steps of:
mounting and fixing a part to be cut on a mounting table;
moving down an ultrasonic vibration rotation unit:
stopping the downward movement of the ultrasonic vibration rotation unit when the cutting blade of the ultrasonic vibration rotation unit reaches a position for cutting the part;
moving the ultrasonic vibration rotation unit linearly for cutting; and
turning and vibrating the cutting blade with ultrasonic waves to cut the part.
According to a second aspect of the present invention, there is provided an ultrasonic vibration cutting apparatus comprising:
a mounting table attached to an apparatus body to fix a part to be cut;
a 3-axis drive unit which is attached to the apparatus body and can move linearly in three directions perpendicular to one another; and
an ultrasonic vibration rotation unit attached to the 3-direction output portion of the 3-axis drive unit to cut the part fixed on the mounting table.
According to a third aspect of the present invention, there is provided an ultrasonic vibration cutting apparatus which further comprises cooling means for cooling the cutting blade of the ultrasonic vibration rotation unit and the part to be cut.
According to a fourth aspect of the present invention, there is provided an ultrasonic vibration cutting apparatus wherein an ultrasonic vibration rotation unit comprises a fixed outer shell attached to the 3-direction output portion of a 3-axis drive unit, a rotary inner shell installed in the fixed outer shell rotably, a transducer stored in the rotary inner shell, a circular resonator connected to the transducer and arranged coaxial to the rotary inner shell, a cutting blade projecting outward from one ends of the fixed outer shell and the rotary inner shell of the resonator and provided at the minimum vibration amplitude point, and a drive source attached to the other end of the fixed outer shell to turn the rotary inner shell.
The above and other objects, features and advantages of the invention will become more apparent from the following description when taken in conjunction with the accompanying drawings.
REFERENCES:
patent: 4343111 (1982-08-01), Inoue
patent: 4401001 (1983-08-01), Gerber et al.
patent: 5177902 (1993-01-01), Baba et al.
patent: 5301587 (1994-04-01), Blaimschein
patent: 6058823 (2000-05-01), Michovo
Ishii Ryoichi
Sato Shigeru
Bray W. Donald
Kanesaka & Takeuchi
Ultex Corporation
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