Metal fusion bonding – Process – Using high frequency vibratory energy
Reexamination Certificate
1999-12-07
2001-03-20
Ryan, Patrick (Department: 1725)
Metal fusion bonding
Process
Using high frequency vibratory energy
C228S001100, C228S106000, C156S073100
Reexamination Certificate
active
06202915
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an ultrasonic vibration bonding method for bonding metal portions to be bonded of a first member to metal portions to be bonded of a second member with ultrasonic vibration transmitted to a resonator from a transducer.
2. Description of the Prior Art
It has already been known that an ultrasonic vibration bonding method is used when an IC chip called “flip chip” or “bare chip” or an LSI package called “BGA” as a semiconductor device is to be mounted on the surface of a circuit board. That is, gold or solder bumps formed on the surface of an IC chip or LSI package are placed upon gold or solder bumps formed on the surface of a circuit board, the IC chip or LSI package is located on a bonding working portion side of a resonator, the circuit board is located on a mounting table side of an ultrasonic vibration bonding apparatus, and the IC chip or LSI package and the circuit board are sandwiched between the resonator and the mounting table by pressure. In this state, the portions to be bonded of the first member and the second member are bonded together with ultrasonic vibration transmitted to the resonator from the transducer.
SUMMARY OF THE INVENTION
However, the IC chip or LSI package and the circuit board which are the first and second members have thickness nonuniformity within a tolerable range. By this nonuniformity, during bonding, portions having low bonding strength may be formed in the portions to be bonded of the first and second members and these portions having low bonding strength may be separated from each other after bonding.
It is therefore an object of the present invention to provide an ultrasonic vibration bonding method which can prevent the bonded portions of the first and second members from being separated from each other.
According to a first aspect of the present invention, there is provided an ultrasonic vibration bonding method comprising the steps of placing metal portions to be bonded formed on a base portion of a first member upon metal portions to be bonded of a second member, pressing the first and second members with a resonator and a mounting table elastically while the base portion of the first member is located on a bonding working portion side of the resonator and the second member is located on the mounting table side, and bonding together the portions to be bonded of the first and second members with ultrasonic vibration transmitted to the resonator from a transducer.
According to a second aspect of the present invention, there is provided an ultrasonic vibration bonding method, wherein the resonator is supported by a holder of a pressing unit at both ends.
According to a third aspect of the present invention, there is provided an ultrasonic vibration bonding method, wherein the base portion of the first member is made from a synthetic resin.
According to a fourth aspect of the present invention, there is provided an ultrasonic vibration bonding method, wherein the synthetic resin has flexibility.
According to a fifth aspect of the present invention, there is provided an ultrasonic vibration bonding method, wherein the second member has a base portion on which the portions to be bonded are formed and the base portion of the second member is located on the mounting table side.
According to a sixth aspect of the present invention, there is provided an ultrasonic vibration bonding method, wherein a buffer member is inserted between the bonding working portion of the resonator and the base portion of the first member.
According to a seventh aspect of the present invention, there is provided an ultrasonic vibration bonding method, wherein the base portion of the first member is weak against impact.
According to an eighth aspect of the present invention, there is provided an ultrasonic vibration bonding method, wherein the second member has a base portion on which the portions to be bonded are formed and the base portion of the second member is located on the mounting table side.
According to a ninth aspect of the present invention, there is provided an ultrasonic vibration bonding method, wherein the buffer member is a layer which can contact at least the entire surface of the bonding working portion of the resonator and the entire surface of the base portion of the first member.
According to a tenth aspect of the present invention, there is provided an ultrasonic vibration bonding method, wherein the buffer member is provided on the bonding working portion of the resonator.
According to an eleventh aspect of the present invention, there is provided an ultrasonic vibration bonding method, wherein the buffer member is provided on the base portion of the first member.
According to a twelfth aspect of the present invention, there is provided an ultrasonic vibration bonding method, wherein the second member has a base portion on which portions to be bonded are formed, the base portion of the second member is located on the mounting table side, the first member and the second member are placed one upon the other with an insulating adhesive therebetween, the adhesive is pressed into spaces between the base portion of the first member and the base portion of the second member from between the portions to be bonded of the first and second members with ultrasonic vibration when the portions to be bonded of the first and second members are bonded together with ultrasonic vibration from the resonator, and the base portions of the first and second members are bonded together with this adhesive.
According to a thirteenth aspect of the present invention, there is provided an ultrasonic vibration bonding method, wherein the adhesive is thermosetting.
According to a fourteenth aspect of the present invention, there is provided an ultrasonic vibration bonding method, wherein the adhesive is non-thermosetting.
The above and other objects, features and advantages of the invention will become more apparent from the following description when taken in conjunction with the accompanying drawings.
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Metals Handbook 9th Ed. vol. 6, pp. 746-756, 1983.
Kanesaka & Takeuchi
Ryan Patrick
Stoner Kiley
Ultex Corporation
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