Ultrasonic vibration bonding chip mounter

Details Ultrasonic vibration bonding chip mounter Ultrasonic vibration bonding chip mounter

1997-04-24

1999-03-23

Ryan, Patrick

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228 9, 228 495, B23K 3102, B23K 3704

Patent

active

058848312

ABSTRACT:
An ultrasonic vibration bonding chip mounter includes a chip carrying unit arranged above a chip supply unit, a prealignment unit and a mounting unit which are arranged in a row and having a movable table which can move back and forth in a direction parallel to a direction where these units are arranged, a pick-up unit, attached to the movable table, for transferring a chip from the chip supply unit to the prealignment unit, and an ultrasonic vibration bonding unit, attached to the movable table, for transferring the chip from the prealignment unit to a mounting unit so that the chips are transferred from the chip supply unit to the prealignment unit and further to the mounting unit by the reciprocation of the movable table one by one.

REFERENCES:
patent: 3790738 (1974-02-01), Laub et al.
patent: 5437301 (1995-07-01), Pham et al.

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