Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work
Patent
1973-04-30
1976-02-17
Husar, Francis S.
Metal fusion bonding
Means to apply vibratory solid-state bonding energy to work
228 41, 228 6, 228 29, 228 32, 228110, 228237, B23K 2102
Patent
active
039387224
ABSTRACT:
An apparatus for bonding beam lead devices and flip chip devices onto mating conductive surfaces on a substrate or other surface and for bonding electrical leads to semiconductor devices and subsequently to mating conductive surfaces on a substrate or other surface, utilizing either thermocompression or ultrasonic energy. The bonding system of this disclosure includes a novel bonding tool having minute spherically shaped bonding surfaces which are caused by a novel pivoting mechanism to individually and successively bond each of a plurality of electrical leads in a complex wobbling motion which permits the bonding surfaces to trace an adjustable rectangular or other predetermined linear path around the periphery of the device. The system also includes a frequency modulated ultrasonic generator and a novel lead composite, developed for this apparatus.
REFERENCES:
patent: 3505726 (1970-04-01), Klienedler et al.
patent: 3575333 (1971-04-01), Kulicke, Jr. et al.
patent: 3700156 (1972-10-01), Hermanns
patent: 3747829 (1973-07-01), Hofmeister
Fitzsimmons Raymond T.
Foulke Richard F.
Kelly James E.
Cannon, Jr. James J.
Hampilos Gus T.
Husar Francis S.
Mech-El Industries, Inc.
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