Ultrasonic soldering bath having an ultrasonic probe extending i

Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work

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228 36, 228 56, 118429, B23K 106

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042035317

ABSTRACT:
An ultrasonic soldering device having a container to hold a bath of molten solder, at least one ultrasonic transducer for creating an ultrasonic wave, a probe connected to each of the transducers and means for mounting the probe to extend through a wall of the container such as a bottom wall into the bath characterized by the mounting including means for increasing and decreasing the amount of probe extending into the bath so that the end of the probe can be adjusted relative to the bath surface. Preferably, a soldering device is a so-called lift solder bath having a hermetically sealed lid provided with a shaft in which the level of bath can be raised or lifted and the probe is mounted to extend into the shaft so that as the level of solder rises in the shaft, the end of the probe can be adjusted to be just beneath the level.

REFERENCES:
patent: 3303983 (1907-02-01), Patrick et al.
patent: 3385262 (1968-05-01), Jacke et al.
patent: 3752381 (1973-08-01), Watson, Jr.
patent: 3833163 (1974-09-01), Denslow et al.
patent: 3934781 (1976-01-01), Klauke et al.
patent: 4047655 (1977-09-01), McCafferty

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