Ultrasonic single-point bonder for semiconductor device fabricat

Details Ultrasonic single-point bonder for semiconductor device fabricat Ultrasonic single-point bonder for semiconductor device fabricat

1995-11-29

1998-08-11

Sells, James

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

228 45, H01L 21607

Patent

active

057915490

ABSTRACT:
A single-point bonder is provided ultrasonically bonding lead fingers extending along different directions onto a semiconductor chip with satisfactory reliability. The bonder contains a first bonding tool for bonding a first set of lead fingers onto a semiconductor chip using a first ultrasonic vibration along a first direction, and a second bonding tool for bonding a second set of lead fingers onto the chip using a second ultrasonic vibration along a second direction different from the first direction. Preferably, the first bonding tool has a first ultrasonic horn for transmitting the first ultrasonic vibration. The second bonding tool has a second ultrasonic horn for transmitting the second ultrasonic vibration. The first and second horns extend along the first and second directions, respectively. The first and second ultrasonic vibrations are parallel to the longitudinal directions of the first and second horns, respectively. The first ultrasonic vibration may be parallel to the longitudinal directions of the first horn, and the second ultrasonic vibration may be parallel to a rotation direction of the second horn.

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