Ultrasonic probe

Details Ultrasonic probe Ultrasonic probe

1994-03-28

1995-07-25

Jaworski, Francis

Surgery

Truss

Pad

A61B 800

Patent

active

054353130

DESCRIPTION:

BRIEF SUMMARY
TECHNICAL FIELD

The present invention relates to a probe used for ultrasonic diagnostic apparatus. More specifically, the invention relates to an ultrasonic probe in which the wiring for electrical connection between the piezoelectric vibrators and signal sending/receiving circuits are eliminated.


BACKGROUND ART

An ultrasonic probe has its individual piezoelectric vibrators connected to signal sending/receiving circuits, by which drive signals is supplied to the piezoelectric vibrators and signals detected by the piezoelectric vibrators are received. A conventional probe has signal sending/receiving circuits formed of component parts that are fabricated by being integrated, and the probe with the integrated circuits built therein has its piezoelectric vibrators and integrated circuits connected electrically through conductive wires. FIG. 5 is a perspective diagram showing an example of the conventional probes. In the figure, reference numeral 1 denotes piezoelectric vibrators that constitute the major part of the probe, and 2 are electronic circuits in connection with the piezoelectric vibrators, with both parts being connected together through connecting conductors 3 that are conductive wires, a flexible substrate, or the like. FIG. 6 shows another example of prior art. In the figure, portions identical to those of FIG. 5 are referred to by the same symbols. In the figure, indicated by 4 is a common electrode of piezoelectric vibrators 1, and 5 are signal electrodes of individual piezoelectric vibrators 1. Since the piezoelectric vibrators and integrated circuits of these conventional probes are connected through conductive wires as mentioned above, the number of electrical wirings increases in the case of a large number of piezoelectric vibrators such as a two-dimensional vibrator array, making the connection much more difficult.


DISCLOSURE OF THE INVENTION

An object of the present invention is to realize an ultrasonic probe wherein wiring is substantially eliminated between the piezoelectric vibrators and signal sending/receiving circuits in the probe.
The inventive ultrasonic probe comprises a vibrator array and a semiconductor wafer on which signal sending/receiving circuits for the vibrator array are integrated, with the wafer being glued to the vibrator array by means of conductive adhesive. Fabricated by being integrated on the semiconductor wafer are signal sending/receiving circuits for individual piezoelectric vibrators positioned coincidently to the arrangement of signal electrodes of the piezoelectric vibrators of the ultrasonic probe, and each signal sending/receiving circuit has a conductive buried layer, which is in connection with the output terminal of the sending circuit and the input terminal of the receiving circuit, exposed to the semiconductor wafer on the side of the vibrator array glued surface.


BRIEF EXPLANATION OF THE DRAWINGS

FIG. 1 is a perspective diagram of the ultrasonic probe based on an embodiment of this invention.
FIGS. 2(A) and 2(B) are diagrams showing the detailed structure of the ultrasonic probe shown in FIG. 1.
FIG. 3 shows an example of the electrical arrangement of the ultrasonic probe shown in FIG. 1.
FIGS. 4(A) and 4(B) are diagrams showing an example of the method of fabricating the integrated circuits on the semiconductor wafer of the ultrasonic probe shown in FIG. 1.
FIG. 5 is a diagram showing an example of the conventional ultrasonic probes.
FIG. 6 is a diagram showing another example of the conventional ultrasonic probes.


BEST MODE FOR CARRYING OUT THE INVENTION

An embodiment of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a perspective diagram of the ultrasonic probe based on an embodiment of this invention. In the figure, reference numeral 1 denotes multiple piezoelectric vibrators, which are arranged in a two-dimensional matrix to form a two-dimensional vibrator array of the ultrasonic probe. 11 is a semiconductor wafer, and 41 are individual integrated circuits (i.e. elemental ICs) that are f

REFERENCES:
patent: 5176140 (1993-01-01), Kami et al.
patent: 5295487 (1994-03-01), Saitoh et al.
patent: 5327895 (1994-07-01), Hashimoto et al.

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