Ultrasonic printed circuit board transducer

Details Ultrasonic printed circuit board transducer Ultrasonic printed circuit board transducer

2007-10-02

2007-10-02

Kim, Paul D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S592100, C029S609100, C216S062000, C216S066000, C216S067000, C310S334000, C381S396000, C381S398000, C367S140000, C427S079000, C427S080000

Reexamination Certificate

active

10493346

ABSTRACT:
There is provided methods for producing an ultrasonic transducer assembly. The methods generally comprise the steps of creating a multi-layered rigid or flexible printed circuit board, having a top surface and bottom surface; creating a patterned conducting layer upon each of the top and bottom surface; creating at least one patterned backplate electrode on the board or as part of a discreet component which is then attached to the board; creating at least one conductive through-hole via integral with the board; roughening at least a portion of each of the at least one backplate to introduce gas pockets in that portion of a surface of the backplate; and attaching thin insulating or dielectric single or multi-layer film on a portion of the board in which the film has an integral conducting surface and in which the conducting surface is configured so as to form a capacitive structure with the at least one backplate.

REFERENCES:
patent: 4993072 (1991-02-01), Murphy
patent: 5153859 (1992-10-01), Chatigny et al.
patent: 5287331 (1994-02-01), Schindel et al.
patent: 5475606 (1995-12-01), Muyshondt et al.
patent: 04 99 237 (1992-08-01), None
patent: 2 231 235 (1999-11-01), None

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