Ultrasonic phased array transducer with an ultralow impedance ba

Details Ultrasonic phased array transducer with an ultralow impedance ba Ultrasonic phased array transducer with an ultralow impedance ba

1997-01-21

1998-12-29

Jaworski, Francis J.

Metal working

Piezoelectric device making

600459, H01L 4122, A61B 800

Patent

active

058528601

ABSTRACT:
The present invention discloses an ultrasonic phased array transducer with an ultralow backfill and a method for making. The ultrasonic phased array includes a low density backfill material having an ultralow acoustic impedance. The backfill material is either an aerogel, a carbon aerogel, an xerogel, or a carbon xerogel. A piezoelectric ceramic material and two matching layers are bonded to the backfill material. In one embodiment, a plurality of interconnect vias are formed in the backfill material with conducting material deposited in the vias. A portion of the bonded matching layers, the piezoelectric ceramic material, and the backfill material have isolation cuts therethrough to form an array of electrically and acoustically isolated individual elements. In a second embodiment, the backfill material is bonded to an electronic layer at a face opposite to the piezoelectric ceramic material and the matching layers. Then isolation cuts are made through the matching layers, the piezoelectric ceramic material, and the backfill material, to form an array of electrically and acoustically isolated individual elements.

REFERENCES:
patent: 4211949 (1980-07-01), Brisken et al.
patent: 4992989 (1991-02-01), Watanabe et al.
patent: 5295484 (1994-03-01), Marcus et al.
patent: 5311095 (1994-05-01), Smith et al.
patent: 5617865 (1997-04-01), Palczewska et al.

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