Ultrasonic laser soldering

Details Ultrasonic laser soldering Ultrasonic laser soldering

1988-12-21

1990-01-16

Seidel, Richard K.

Metal fusion bonding

Process

Using high frequency vibratory energy

228179, 228 11, 228262, 219 8518, 21912163, 21912164, B23K 2010, B23K 2600

Patent

active

048937428

ABSTRACT:
Laser soldering in a tape automated bonding procedure is carried out on outer ends of a number of high density leads (72) printed on a film (78) of mylar and having inner ends connected to a circuit chip (70). The outer ends of the leads are soldered, without the use of flux, by application of heat and ultrasonic energy in a timed program while pressing an end (52) of the lead to be soldered against the substrate pad to which it is to be soldered. An elongated ultrasonically vibratable capillary (16) is employed to press the wire down against its pad (54) and to receive and guide an optical fiber (44) through which a beam of laser energy is fed coaxially through the capillary (16) to heat the wire end (52).

REFERENCES:
patent: 3304403 (1967-02-01), Harper
patent: 3463898 (1969-08-01), Takaoka et al.
patent: 3734382 (1973-05-01), Spanjer
patent: 3874963 (1975-04-01), Barger
patent: 3889364 (1975-06-01), Krueger
patent: 4320281 (1982-03-01), Cruickshank et al.
patent: 4534811 (1985-08-01), Ainslie et al.
Research Disclosure, "Improved Laser Microweld Technique", Kenneth Mason Publications LTD, England, No. 275, Mar. 1987.
IBM Technical Disclosure Bulletin, "Novel Laser Soldering Process . . .", vol. 3, No. 31, pp. 206, 207, Aug. 1988.

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