Ultrasonic jet semiconductor wafer cleaning apparatus

Details Ultrasonic jet semiconductor wafer cleaning apparatus Ultrasonic jet semiconductor wafer cleaning apparatus

1993-12-17

1994-11-29

Stinson, Frankie L.

Cleaning and liquid contact with solids

Apparatus

With means to movably mount or movably support the work or...

134181, 134184, 134902, 2391022, B08B 310

Patent

active

053680545

ABSTRACT:
An ultrasonic jet semiconductor wafer cleaning apparatus for removing debris from a surface of a semiconductor wafer as the wafer is rotated about a prescribed axis in a cleaning plane is disclosed. The apparatus comprises a housing having a principal axis, an inlet port, and an outlet port; a means for producing focused ultrasonic waves of acoustic energy concentric with and incident the outlet port to form a jet stream of cleaning liquid released through the outlet port; a focal point positioning means for adjustably positioning a focal point of the focused ultrasonic wave producing means between a first focal point position and a second focal point position along an axis; and a means coupled to the housing for sweeping the housing in an reciprocating manner along a sweep path.

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