Measuring and testing – Vibration – By mechanical waves
Reexamination Certificate
2006-03-31
2008-11-25
Williams, Hezron (Department: 2856)
Measuring and testing
Vibration
By mechanical waves
C073S602000, C073S625000, C073S628000, C073S641000, C600S443000, C600S447000
Reexamination Certificate
active
07454973
ABSTRACT:
In the ultrasonic inspection method and equipment, a high-resolution and high-S/N-ratio inspection image can be speedily acquired with ease-of-operability. Inspection of the inside of the inspection target is performed by changing incident angle of the ultrasonic wave oscillated from the array-probe ultrasonic sensor. Then, while performing the inspection, the array-probe ultrasonic sensor is sequentially displaced from the position to the position via the position by using the displacement member. This displacement allows acquisition of inspection images on each position basis. Finally, the inspection images thus acquired are visualized as a processed image by adding or averaging the inspection images by shifting the images by displacement quantity of the array-probe ultrasonic sensor.
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Kondo, Rinsei, Ohashi, Yoshimasa, and Minomori Toshiro, “Digital Signal Processing in Measurements and Sensors”, pp. 143-186, Digital Signal Processing Series vol. 12, published on May 20, 1993 by Syoukodo Publishing Inc.
Baba Atsushi
Kono Naoyuki
Musha Yoshinori
Crowell & Moring LLP
Hitachi , Ltd.
M Saint Surin J
Williams Hezron
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