Measuring and testing – Vibration – By mechanical waves
Patent
1989-07-26
1991-08-27
Williams, Hezron E.
Measuring and testing
Vibration
By mechanical waves
G01N 2900
Patent
active
050423053
ABSTRACT:
According to the present invention, a cursor is displayed on a screen of display of an ultrasonic image obtained by scanning the surface of an inspection object by use of a probe formed by arrangement of array elements and, further, the cursor is moved to a desired position of the ultrasonic image so that ultrasonic waves are emitted to a position of the surface of the object corresponding to the aforementioned position and the reflection wave signals are displayed in another display portion. Accordingly, not only ultrasonic flaw detection (C-scope) in a plane of the object can be conducted, but also ultrasonic flaw detection (B-scope) in the direction of depth in a desired position of the object can be conducted simultaneously. Consequently, detailed flaw information, such as a flaw type, a flaw position, a flaw size and a flaw shape, in the object can be detected quickly.
REFERENCES:
patent: 3575042 (1968-04-01), Lovelace et al.
patent: 4213183 (1980-07-01), Barron et al.
patent: 4381787 (1983-05-01), Hottinger
patent: 4481822 (1984-11-01), Kubota et al.
patent: 4664122 (1987-05-01), Yano
"Method for Correcting Ultrasonic Flaw Detection Image", by Otsuka, Pat. Abstracts of Japan, vol. 12, No. 25, Jan. 1988.
Arana Louis M.
Hitachi Construction Machinery Co. Ltd.
Williams Hezron E.
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